Threshold gate and threshold logic array

ABSTRACT

Threshold gates and related circuitry are disclosed. In one embodiment, a threshold gate includes a threshold realization element and a magnetic tunnel junction (MTJ) element. The MTJ element is switchable from a first resistive state to a second resistive state. To realize a threshold function with the MTJ element, the threshold realization element is configured to switch the magnetic tunnel junction element from the first resistive state to the second resistive state in accordance with the threshold function. In this manner, the threshold gate may implement a threshold function that provides an output just like a complex Boolean function requiring several Boolean gates.

RELATED APPLICATION

This application claims the benefit of provisional patent applicationSer. No. 61/651,646, filed May 25, 2012, the disclosure of which ishereby incorporated herein by reference in its entirety.

FIELD OF THE DISCLOSURE

This disclosure relates generally to threshold gates and circuitryassociated with threshold gates.

BACKGROUND

Often, various Boolean gates are required to implement a complex Booleanfunction. As the number of Boolean gates increases, the amount of spaceneeded to provide the Boolean gates in an integrated circuit (IC) alsoincreases. In addition, how fast the IC circuit can generate an outputfor the Boolean function, and the amount of power required by the ICcircuit is determined by the number of Boolean gates needed to implementthe Boolean function. Furthermore, Boolean gates are volatile and thuscannot store an output for the Boolean function if the power is turnedoff.

Accordingly, there is a need to reduce the number of Boolean gatesrequired by an IC circuit.

SUMMARY

Threshold gates and related circuitry are disclosed in this disclosure.The threshold gate may implement a threshold function that provides anoutput just like a complex Boolean function requiring numerous Booleangates. In one embodiment, a threshold gate includes a thresholdrealization element and a magnetic tunnel junction (MTJ) element. TheMTJ element is switchable from a first resistive state to a secondresistive state. To realize a threshold function with the MTJ element,the threshold realization element is configured to switch the MTJelement from the first resistive state to the second resistive state inaccordance with the threshold function. In this manner, the firstresistive state and the second resistive state of the MTJ element may beutilized to represent an output of the threshold function. Since the MTJelement is non-volatile, the output of the threshold function is storedeven if power to the threshold gate is interrupted. Furthermore, thethreshold function implemented by the threshold gate may provide theoutput in the same manner as the output of a complex Boolean functionrequiring several Boolean gates. Thus, the threshold gate may be morecompact, faster, and/or more space efficient than the Boolean gatesrequired to generate the same output.

Those skilled in the art will appreciate the scope of the presentdisclosure and realize additional aspects thereof after reading thefollowing detailed description of the preferred embodiments inassociation with the accompanying drawing figures.

BRIEF DESCRIPTION OF THE DRAWING FIGURES

The accompanying drawing figures incorporated in and forming a part ofthis specification illustrate several aspects of the disclosure, andtogether with the description serve to explain the principles of thedisclosure.

FIG. 1 illustrates a block diagram of an exemplary embodiment of athreshold gate that includes a threshold realization element and amagnetic tunnel junction (MTJ) element.

FIG. 2A illustrates one embodiment of the MTJ element shown in FIG. 1.

FIG. 2B illustrates one embodiment of the MTJ element shown in FIG. 2Ain an anti-parallel magnetic orientation alignment state and in a highresistance state.

FIG. 2C illustrates one embodiment of the MTJ element shown in FIG. 2Ain a parallel magnetic orientation alignment state and in a lowresistance state.

FIG. 3 illustrates one embodiment of the threshold gate shown in FIG. 1with the MTJ element shown in FIG. 2 and a majority function element asone embodiment of the threshold realization element shown in FIG. 1.

FIG. 4 is a graph illustrating a switching current magnitude as afunction of pulse duration for a population of MTJ elements fabricatedwith the same topology as the MTJ element shown in FIG. 2A.

FIG. 5 illustrates another embodiment of a threshold gate shown in FIG.1, wherein the threshold gate includes the majority function elementshown in FIG. 3 and the MTJ element shown in FIG. 2A along with adifferential state generation element.

FIG. 6 illustrates one embodiment of a sequential state threshold logicelement that includes the threshold gate shown in FIG. 5, a sensingamplifier element connected to the differential state generationelement.

FIG. 7 illustrates one embodiment of a threshold logic block ofthreshold gates, which forms a threshold logic array, and wherein a pairof sequential state threshold logic elements each includes a pair of thethreshold gates.

FIG. 8 is a timing diagram illustrating a clock signal, a first writesignal, a first read signal, a second write signal, and a second readsignal used to time the operation of the threshold logic block in FIG.7.

FIG. 9 illustrates one embodiment of one of the sequential statethreshold logic elements shown in FIG. 7 having a pair of thresholdgates and one embodiment of a sense amplifier element.

FIG. 10 illustrates a two bit carry look ahead (CLA) adder networkconsisting of abstract threshold logic gates.

FIG. 11 illustrates one embodiment of a pattern of various four bit CLAadders implemented using several of the two bit CLA adders describedabove in FIG. 10.

DETAILED DESCRIPTION

The embodiments set forth below represent the necessary information toenable those skilled in the art to practice the embodiments andillustrate the best mode of practicing the embodiments. Upon reading thefollowing description in light of the accompanying drawing figures,those skilled in the art will understand the concepts of the disclosureand will recognize applications of these concepts not particularlyaddressed herein. It should be understood that these concepts andapplications fall within the scope of the disclosure and theaccompanying claims.

This disclosure relates generally to threshold gates and relatedcircuitry. Threshold gates are configured to implement a thresholdfunction, which may map a Boolean input representing binary values to anoutput in the same manner as an implementation of the same functionusing conventional AND-OR Boolean gates. This may be advantageousbecause a single threshold gate may be able to generate the output whilethe equivalent representation of the Boolean function using AND-OR gatesmay require several Boolean gates. Accordingly, the threshold gate maybe more compact, faster, and/or more space efficient than the network ofBoolean gates required to implement the same Boolean function.

A threshold gate is a non-decomposable primitive circuit that realizes athreshold function to provide an output by comparing some physicalquantity such as charge, voltage or current. Below are exemplaryequations that demonstrate various examples of threshold functions thatmay be implemented by threshold gates:

$\begin{matrix}{{f_{T}\left( {x_{1},{x_{2}\ldots\; x_{n}}} \right)} = \left\{ \begin{matrix}{1,} & {{{if}\mspace{14mu}{\sum\limits_{i = 1}^{n}{w_{i}x_{i}}}} \geq T} \\{0,} & {Otherwise}\end{matrix} \right.} & (1) \\{{f_{T}\left( {x_{1},{x_{2}\ldots\; x_{n}}} \right)} = \left\{ \begin{matrix}{1,} & {{{if}\mspace{14mu}{\sum\limits_{i = 1}^{n}{w_{i}x_{i}}}} \leq T} \\{0,} & {Otherwise}\end{matrix} \right.} & (2) \\{{f_{T}\left( {x_{1},{x_{2}\ldots\; x_{n}}} \right)} = \left\{ \begin{matrix}{0,} & {{{if}\mspace{14mu}{\sum\limits_{i = 1}^{n}{w_{i}x_{i}}}} \geq T} \\{1,} & {Otherwise}\end{matrix} \right.} & (3) \\{{f_{T}\left( {x_{1},{x_{2}\ldots\; x_{n}}} \right)} = \left\{ \begin{matrix}{0,} & {{{if}\mspace{14mu}{\sum\limits_{i = 1}^{n}{w_{i}x_{i}}}} \leq T} \\{1,} & {Otherwise}\end{matrix} \right.} & (4)\end{matrix}$

Different threshold gates may be utilized to operate in accordance withthe various threshold functions shown above. In the equations above,parameters x₁, x₂ . . . x_(n) is a set of Boolean variables wherein eachBoolean variable in the set of Boolean variables has a binary value.Parameters w₁, w₂ . . . w_(n) is a set of weights wherein each weight inthe set of weights has an integer value. The T is a threshold value ofthe threshold function f_(T). A Boolean function f_(B)(x₁, x₂ . . .x_(n)) may be implemented by a threshold gate if the threshold gate isoperable to provide the weight values in the set of weights of thresholdfunction f_(T)(x₁, x₂ . . . x_(n)) and the threshold value T of thethreshold function such that the threshold function f_(T)(x₁, x₂ . . .x_(n)) implemented by the threshold gate maps the set of Booleanvariables to the same output as the Boolean function f_(B)(x₁, x₂ . . .x_(n)). The threshold function f_(T)(x₁, x₂ . . . x_(n)) is representedby the set of weights and the threshold value in the following format[w₁, w₂ . . . w_(n); T]. The output of the Boolean function has a binaryvalue and thus so does the output of the threshold function.

FIG. 1 illustrates one embodiment of a threshold gate 10 in accordancewith this disclosure. The threshold gate 10 includes a thresholdrealization element 12 and a magnetic tunnel junction (MTJ) element 14.The MTJ element 14 is configured to be switchable from a first resistivestate to a second resistive state and from a second resistive state tothe first resistive state. The first resistive state and the secondresistive state are each non-volatile resistive states. In other words,the MTJ element 14 can maintain the first resistive state and the secondresistive state without external power. In the MTJ element 14, at leasttwo different ferromagnetic layers are used. The two ferromagneticlayers are separated by tunneling barrier, which may be an electricalinsulator. Whether the MTJ element 14 is in the first resistive state orthe second resistive state depends on whether magnetic orientations ofthe different ferromagnetic layers on both sides of the tunnelingbarrier are aligned in parallel or in anti-parallel fashion. Thus, theMTJ element 14 is also configured to be switchable from a first magneticorientation alignment state to a second magnetic orientation alignmentstate and from the second magnetic orientation alignment state to thefirst magnetic orientation state. The MTJ element 14 is a type ofpassive resistive element. In alternative embodiments, other types ofpassive resistive elements may be used, such as a memristor element, aphase change device (i.e., a phase change device used in Phase ChangeRAM), and/or the like. Like the MTJ element 14, the passive resistiveelement has two or more distinguishable non-volatile resistance states.

For example, in one embodiment, the first resistance state is a highresistance state and the second resistance state is a low resistancestate. Furthermore, the first magnetic orientation alignment state is ananti-parallel magnetic orientation state in which the magneticorientations for the ferromagnetic materials on opposing sides of thetunneling barrier are unaligned and in substantially oppositedirections. Additionally, the second magnetic orientation alignmentstate is a parallel magnetic orientation state in which the magneticorientations for the ferromagnetic materials on opposing sides of thetunneling barrier are aligned and in substantially the same directions.In this embodiment, the MTJ element 14 may be configured to generate acurrent of electrons tunneling across the tunneling barrier. Given theapplication of a magnetic field 3, a density of states of spin-up andspin-down electrons is provided on opposing sides of the tunnelingbarrier, which defines the magnetic orientations of the ferromagneticmaterials. Accordingly, the MTJ element 14 is in the high resistancestate as a result of the anti-parallel magnetic orientation statebecause there are less spin-up and spin-down electrons on opposing sidesof the tunneling barrier to provide the tunneling current. Also, the MTJelement 14 is in the low resistance state as a result of the parallelmagnetic orientation state because there more spin-up and spin-downelectrons on opposing sides of the tunneling barrier to provide thetunneling current.

The threshold realization element 12 is configured to switch the passiveresistive element from the first resistive state to the second resistivestate in accordance with a threshold function. For instance, thethreshold realization element 12 in FIG. 1 is configured to switch theMTJ element 14 from the first resistive state to the second resistivestate in accordance with the threshold function. In other words, thethreshold realization element 12 is configured to switch the MTJ element14 from the first magnetic orientation alignment state to the secondmagnetic orientation alignment state in accordance with the thresholdfunction. The first resistive state and/or the first magneticorientation alignment state may be used so that the output represents alogical “1” or a logical “0” while the second resistive state and/or thesecond magnetic orientation alignment state may be used so that theoutput represents an antipodal logical “0” or a logical “1.” Thethreshold realization element 12 may also be configured to switch theMTJ element 14 from the second resistance state (and the parallelmagnetic orientation alignment state) to the first resistance state (andthe anti-parallel magnetic orientation state or other circuitry (notshown) may be utilized to do this.

To switch the MTJ element 14 from the first resistive state to thesecond resistive state, the threshold realization element 12 isconfigured to generate a signal 16. The MTJ element 14 is operable toreceive the signal 16 and is switchable from the first resistive state(and the first magnetic orientation alignment state) to the secondresistive state (and the second magnetic orientation alignment state) inresponse to the signal 16 having a signal level greater than a switchingmagnitude. The signal level may be a voltage level and/or a currentlevel of the signal 16 and the switching magnitude may be a switchingvoltage magnitude and/or a switching current magnitude. In oneembodiment, the signal level of the signal 16 is greater than theswitching magnitude for a given time duration, d. When the signal levelof the signal 16 is greater than the switching magnitude for the timeduration, d, there is an adjustment in the alignment of the magneticorientations of the ferromagnetic materials. Thus, the MTJ element 14 isswitched from the first magnetization orientation state (and the firstresistive state) to the second magnetization orientation state (and thesecond resistive state) in response to the signal level of the signal 16being greater than the switching magnitude for the given time duration,d.

In this embodiment, the threshold realization element 12 is configuredto receive a Boolean input BI representing Boolean variables and athreshold input TI that indicates the threshold value T. The thresholdrealization element 12 is configured to adjust the threshold value ofthe threshold function so that the threshold value T corresponds to theswitching magnitude. The Boolean input BI may represent the Booleanvariables x₁, x₂ . . . x_(n) for the threshold function. The signallevel of the signal 16 is provided by the threshold realization element12 such that the signal level represents a scalar product of the set ofBoolean variables x₁, x₂ . . . x_(n) and the set of weights of thethreshold function. In one embodiment, the weight values for the weightsw₁, w₂ . . . w_(n) of the threshold function are represented by a numberof times that the Boolean variables x₁, x₂ . . . x_(n) are provided inthe Boolean input BI.

FIG. 2A illustrates one embodiment of an MTJ element 20, which is anexample of the MTJ element 14 shown in FIG. 1. In this embodiment, theMTJ element 20 is a spin torque transfer (STT) MTJ element. The MTJelement 20 includes a first magnetic layer 22 and a second magneticlayer 24. The first magnetic layer 22 and second magnetic layer 24 aremade from a ferromagnetic material. An electrical contact 26 isconnected to the first magnetic layer 22 while a second electricalcontact 28 is connected to the second magnetic layer 24. A tunnelingbarrier is defined between the first magnetic layer 22 and the secondmagnetic layer 24. In this embodiment, a dielectric layer 30 is providedbetween the first magnetic layer 22 and the second magnetic layer 24 todefine the tunnel barrier.

As shown in FIG. 2A, the first magnetic layer 22 is magnetized so as tohave a magnetic orientation state and the second magnetic layer 24 ismagnetized so as to have a magnetic orientation state. Since the MTJelement 20 in this embodiment is an STT MTJ element, the first magneticlayer 22 is a free magnetic layer where the magnetic orientation stateis adjustable while the second magnetic layer 24 is a fixed magneticlayer where the magnetic orientation state is fixed. The MTJ element 20is switchable from a first magnetic orientation alignment state to asecond magnetic orientation alignment state magnetic orientation. In onemagnetic orientation alignment state the magnetic orientation state ofthe first magnetic layer 22 and the magnetic orientation state of thesecond magnetic layer 24 have one alignment with respect to one another.In another magnetic orientation alignment state, the magneticorientation state of the first magnetic layer 22 and the magneticorientation state of the second magnetic layer 24 have another alignmentwith respect to one another. The MTJ element 20 has a tunnelmagnetoresistance (TMR) that defines a ratio of a resistance (R1) in afirst resistive state and a resistance (R2) in a second resistive state.The R1 is the resistance of the MTJ element 20 in the first resistivestate when the MTJ element 20 is one of the magnetic orientationalignment states and the resistance R2 is the resistance of the MTJelement 20 in the second resistive state in another one of the magneticorientation alignment states.

FIG. 2B illustrates the MTJ element 20 in an anti-parallel orientationalignment state. The MTJ element 20 is thus in a high resistance statein the anti-parallel orientation alignment state. In the anti-parallelorientation alignment state and the high resistance state, the magneticorientation state of the first magnetic layer 22 and the magneticorientation state of the second magnetic layer 24 are unaligned. Aresistance (R_(High)) is the resistance of the MTJ element 20 in thehigh resistance state and in the anti-parallel orientation alignmentstate.

FIG. 2C illustrates the MTJ element 20 in a parallel orientationalignment state. The tunnel magnetoresistance of the MTJ element 20 isthus in a low resistance state in the parallel orientation state. In theparallel orientation alignment state and the low resistance state, themagnetic orientation state of the first magnetic layer 22 and themagnetic orientation state of the second magnetic layer 24 are aligned.A resistance (R_(Low)) is the resistance of the MTJ element in theparallel orientation alignment state and in the low resistance state. Inresponse to the signal level of the signal 16 being provided at theswitching magnitude for the time duration d, the threshold realizationelement 12 shown in FIG. 1, is configured to adjust the magneticorientation state of the free magnetic layer and thereby switches theMTJ element from the anti-parallel magnetic orientation state (and thehigh resistance state) to the parallel magnetic orientation state (andthe low resistance state)

The TMR of the MTJ element 20 is given by:TMR=(R _(High) −R _(Low))/R _(Low).

Referring now to FIGS. 2A-2C, the MTJ element 20 in FIG. 2A isconfigured to receive a signal 32 having a signal level across the MTJelement 20. When the signal level is equal to or greater than aswitching magnitude, the MTJ element 20 switches from the first magneticorientation alignment state to the second magnetic orientation alignmentstate. Accordingly, when the signal level is equal to or greater thanthe switching magnitude, the MTJ element 20 switches from the firstresistive state to the second resistive state. For example, the MTJelement 20 switches from the anti-parallel orientation state and thehigh resistive state in FIG. 2B to the parallel orientation state andthe low resistive state in FIG. 2C when the signal level of the signal16 is equal to or greater than the switching magnitude. In oneembodiment, the signal 32 is a signal current having a current level land the switching magnitude is a switching current magnitude lc.Additionally, when the negative of the signal level (signal 32 flowingfrom contact 28 to contact 26) is equal to or greater than the switchingmagnitude, the MTJ element 20 switches from the second magneticorientation alignment state to the first magnetic orientation alignmentstate. Accordingly, when the negative of the signal level is equal to orgreater than the switching magnitude, the MTJ element 20 switches fromthe second resistive state to the first resistive state. For example,the MTJ element 20 switches from the parallel orientation state and thelow resistive state in FIG. 2C to the anti-parallel orientation stateand the high resistive state in FIG. 2B when the negative of the signallevel of the signal 16 is equal to the switching magnitude. In theembodiment described above, the negative of the signal 16 is the currentmagnitude l but in an opposite current direction across the MTJ element20.

FIG. 3 illustrates one embodiment of a threshold gate 34 having amajority function element 36 and the MTJ element 20 shown in FIGS.2A-2C. The threshold gate 34 is one embodiment of the threshold gate 10shown in FIG. 1, the majority function element 36 is one embodiment ofthe threshold realization element 12 shown in FIG. 1. The majorityfunction element 36 has a plurality of transistors (referred togenerically as transistors 38 and specifically as transistors 38-1,38-2, 38-3, 38-4, 38-5, 38-6, 38-7, 38-8) coupled in parallel. In thisexample, the transistors 38 are P-channel Field Effect Transistors(PFETs) and more specifically are P-channel Metal on Oxide Field EffectTransistors (PMOSs). There are an integer number N of the transistors38. The majority function element 36 is configured to generate athreshold realization current 40 at a current level provided inaccordance with a number of the transistors 38 that are activated in themajority function element 36. The threshold realization current 40 is anembodiment of the signal 32 shown in FIGS. 2A-2C. A integer number, k,is a number of the transistors 38 that need to be activated for thecurrent level of the threshold realization current 40 to be at or abovethe switching current magnitude lc. In other words, when k or more ofthe transistors 38 are activated, the majority function element 36generates the threshold realization current 40 with the current levelabove the switching current magnitude lc, and thus the MTJ element 20 isswitched from the first magnetization orientation alignment state andthe first resistive state to a second magnetization orientationalignment state and the second resistive state. In this embodiment, thefirst magnetization orientation alignment state is the anti-parallelmagnetization alignment state and the first resistive state is the highresistive state shown in FIG. 2B. The second magnetization orientationalignment state is the parallel magnetization alignment state and thesecond resistive state is the low resistive state shown in FIG. 2C. Inother alternative embodiments, the first magnetization orientationalignment state is the parallel magnetization alignment state and thefirst resistive state is the low resistive state shown in FIG. 2C whilethe second magnetization orientation alignment state is theanti-magnetization alignment state and the second resistive state is thehigh resistive state in FIG. 2B. In these alternative embodiments, thethreshold realization current 40 may be in an opposite direction orposition of the fixed magnetic layer and the free magnetic layer may beoppositely disposed with respect to the threshold realization element12.

The majority function element 36 was thus configured to implement a k/Nmajority function whose majority integer value is the integer number, k.If the transistors 38 each have a width, w, a current level, l_(k) ofthe threshold realization current 40 drawn by k number of transistors(each of width w) should exceed the switch current magnitude lc of theMTJ element 20 at a current duration, d. Accordingly, if k or more ofthe transistors 38 are on, the MTJ element 20 is switched from highresistance state (and anti-parallel magnetization orientation state) tolow resistance state (and parallel magnetization orientation state).

The majority element can thus realize a k/N majority function and any ofits derivatives. The threshold gate 34 is thus programmable to implementany threshold function that corresponds to the k/N majority function orany of its derivatives. For example, the majority function element 36 isconfigured to receive a set of bit signals (referred to generically aselement 42 and specifically to elements 42-1, 42-2, 42-3, 42-4, 42-5,42-6, 42-7, 42-8). In this embodiment, the integer number N=8 and theinteger number k is 4. More specifically, a gate of the transistor 38-1receives a bit signal 42-1 that represents a bit, b1. A gate of thetransistor 38-2 receives a bit signal 42-2 that represents a bit, b2. Agate of the transistor 38-3 receives a bit signal 42-3 that represents abit, b3. A gate of the transistor 38-4 receives a bit signal 42-4 thatrepresents a bit, b4. A gate of the transistor 38-5 receives a bitsignal 42-5 that represents a bit, b5. A gate of the transistor 38-6receives a bit signal 42-6 that represents a bit, b6. A gate of thetransistor 38-7 receives a bit signal 42-7 that represents a bit, b7. Agate of the transistor 38-8 receives a bit signal 42-8 that represents abit, b8.

To implement the majority function, the current level of the thresholdrealization current 40 is provided by the majority function element 36in accordance with the majority function on the bit signals 42. Morespecifically, the majority function element 36 is configured to generatethe threshold realization current 40 such that the current levelcorresponds with an aggregated sum of the bits b1-b8 represented by thebit signals 42. In particular, the current level of the thresholdrealization current 40 that monotonically corresponds with theaggregated sum (b1+b2+b3+b4+b5+b6+b7+b8) of the bits b1-b8 and theinteger number k represents a majority value. It should be noted thatthe current level of the threshold realization current 40 might not be alinear function of the sum of the bits b1-b8. It could be a monotonicfunction of the sum of the bits b1-b8. The monotonic behavior of thethreshold realization current 40 is all that is needed to realize athreshold function. For example, in an alternate embodiment, thethreshold realization current 40 supplied from the active PMOStransistors is amplified and/or attenuated before feeding to a passiveresistive element such as an STT-MTJ element.

In FIG. 3, the threshold gate 34 implements the majority functionb1+b2+b3+b4+b5+b6+b7+b8<=k, where the integer number k equals a minimumnumber of the transistors 38 that are required to be activated so thatthe signal level of the threshold realization current 40 is above theswitching current magnitude, lc. Thus, every threshold function that canbe implemented by the majority function b1+b2+b3+b4+b5+b6+b7+b8<=k canbe implemented by the threshold gate 34. This is because when k or moreof the bits 1-8 are received as representing a logical 0, the majorityfunction element 36 generates the threshold realization current 40 withthe current level above the switching current magnitude lc. In thisembodiment, with N=8 and k=4, forty-seven different threshold functionscan be implemented by the majority function element 36. Accordingly, themajority function element 36 is programmable in accordance with a set ofweights and a threshold value of a threshold function so that themajority function element 36 implements the threshold function.Assignments to each of the bits b1-b8 represented by the bit signals 42are organized by the representation of (b1, b2, b3, b4, b5, b6, b7, b8).

As an example, the Boolean function f=ab+bc+ca, where a, b, c are eachBoolean variables, corresponds to a threshold function having a set ofweights and a threshold value of [1, 1, 1; 2]. With N=8 and k=4, themajority value is equal to 4; however, the threshold value of thethreshold function is equal to 2. The threshold function is realized ifone of the bits b1-b8 is assigned to the Boolean variable a, one of thebits of b1-b8 is assigned to the Boolean variable, b, one of the Booleanvariables is assigned to the Boolean variable, c, two of the transistors38 are maintained so as to be activated, and a remainder of thetransistors 38 are deactivated.

More specifically, the majority function element 36 is programmable torealize the threshold function of [1, 1, 1; 2] by assigning the bitsb1-b8 represented by the bit signals 42 in accordance with the set ofweights and the threshold value. Boolean variable, a, is provided as thebit b1 represented by the bit signal 42-1. The Boolean variable, b, isprovided as the bit b2 represented by the bit signal 42-2. The Booleanvariable, c, is provided as the bit b3 represented by the bit signal42-3. The bit b4 is provided as a logical 0 represented by the bitsignal 42-4. The bit b5 is provided as a logical 0 represented by thebit signal 42-5. The bit b6 is provided as a logical 1 represented bythe bit signal 42-6. The bit b7 is provided as a logical 1 representedby the bit signal 42-7. The bit b8 is provided as a logical 1represented by the bit signal 42-8. This assignment of the thresholdfunction [1, 1, 1; 2] to the majority function implemented by themajority function element 36 is represented as (a, b, c, 1, 1, 0, 0, 0).Thus, in this case, bits 1-3 are an example of the Boolean input BI withregard to FIG. 1 described above and bits 4-8 are an example of thethreshold input TI with regard to FIG. 1.

For example, a Boolean function is a v b v c v d v e, where a, b, c, d,and e are Boolean variables. The Boolean function, a v b v c v d v ecorresponds to a threshold function with a set of weights and athreshold value of [1, 1, 1, 1, 1; 1]. The majority function element 36is programmable to realize the threshold function of [1, 1, 1, 1, 1; 1]by assigning the bits b1-b8 represented by the bit signals 42 inaccordance with the set of weights and the threshold value. Booleanvariable, a, is provided as the bit b1 represented by the bit signal42-1. The Boolean variable, b, is provided as the bit b2 represented bythe bit signal 42-2. The Boolean variable, c, is provided as the bit b3represented by the bit signal 42-3. The Boolean variable, d, is providedas the bit b4 represented by the bit signal 42-4. The Boolean variable,e, is provided as the bit b5 represented by the bit signal 42-5. The bitb6 is provided as a logical 0 represented by the bit signal 42-6. Thebit b7 is provided as a logical 0 represented by the bit signal 42-7.The bit b8 is provided as a logical 0 represented by the bit signal42-8. This assignment of the threshold function [1, 1, 1, 1, 1; 1] tothe majority function implemented by the majority function element 36 isrepresented as (a, b, c, d, e, 0, 0, 0). Thus, in this case, bits 1-5are an example of the Boolean input BI with regard to FIG. 1 describedabove and bits 6-8 are an example of the threshold input TI with regardto FIG. 1.

As another example, a Boolean function of abcd corresponds to athreshold function with a set of weights and a threshold value of [1, 1,1, 1; 4]. The majority function element 36 is programmable to realizethe threshold function of [1, 1, 1, 1; 4] by assigning the bits b1-b8represented by the bit signals 42 in accordance with the set of weightsand the threshold value. Boolean variable, a, is provided as the bit b1represented by the bit signal 42-1. The Boolean variable, b, is providedas the bit b2 represented by the bit signal 42-2. The Boolean variable,c, is provided as the bit b3 represented by the bit signal 42-3. TheBoolean variable, d, is provided as the bit b4 represented by the bitsignal 42-4. The bit b5 is provided as a logical 1 represented by thebit signal 42-5. The bit b6 is provided as a logical 1 represented bythe bit signal 42-6. The bit b7 is provided as a logical 1 representedby the bit signal 42-7. The bit b8 is provided as a logical 1represented by the bit signal 42-8. This assignment of the thresholdfunction [1, 1, 1, 1; 4] to the majority function implemented by themajority function element 36 is represented as (a, b, c, d, 1, 1, 1, 1).Thus, in this case, bits 1-4 are an example of the Boolean input BI withregard to FIG. 1 described above and bits 5-8 are an example of thethreshold input TI with regard to FIG. 1.

As another example, a Boolean function of ab v (a v b)(cd v de v ce)corresponds to a threshold function with a set of weights and athreshold value of [2, 2, 1, 1, 1; 4]. The majority function element 36is programmable to realize the threshold function of [2, 2, 1, 1, 1; 4]by assigning the bits b1-b8 represented by the bit signals 42 inaccordance with the set of weights and the threshold value. Booleanvariable, a, is provided as the bit b1 represented by the bit signal42-1. The Boolean variable, a, is also provided as the bit b2represented by the bit signal 42-2. The Boolean variable, b, is providedas the bit b3 represented by the bit signal 42-3. The Boolean variable,b, is also provided as the bit b4 represented by the bit signal 42-4.The Boolean variable, c, is provided as the bit b5 represented by thebit signal 42-5. The Boolean variable, d, is provided as the bit b6represented by the bit signal 42-6. The Boolean variable, e, is providedas the bit b7 represented by the bit signal 42-7. The bit b8 is providedas a logical 1 represented by the bit signal 42-8. This assignment ofthe threshold function [2, 2, 1, 1, 1; 4] to the majority functionimplemented by the majority function element 36 is represented as (a, a,b, b, c, d, e, 1). Thus, in this case, bits 1-7 are an example of theBoolean input BI with regard to FIG. 1 described above and bit 8 is anexample of the threshold input TI with regard to FIG. 1. The bits 1 and2 both represent the Boolean variable a to represent a weight value oftwo, and bits 3-4 both represent the Boolean variable b to represent aweight value of two.

FIG. 4 illustrates a plot of a function lc(d) with the MTJ element 20fabricated in accordance with the design parameters having parametervalues in the table below.

Variable Description Default Value T_(ox) Dielectric Layer Thickness0.85 nm Area MTJ Surface 65 nm × 65 nm × π/4 R_(low) Resistance of LowResistance State   3K Ω R_(high) Resistance of the High Resistance State6.6K Ω TMR (0) TMR ratio with zero bias voltage 120%

The table above illustrates design parameters for one model of the MTJelement 20. The function lc(d) is for the MTJ element 20 and showsvalues of the switching current magnitude lc mapped to pulse duration dat various operating points (referred to generically as p andspecifically as p1, p2, p3, p4, p5, p6, p7, p8, p9). for the switchingcurrent magnitude lc of a population of the MTJ element 20, designed inaccordance with the MTJ element 20. While a function lc(d) is actuallyexponential, the lc(d) is approximately linear over a limited range ofthe values of the pulse duration d. Error bars (referred to genericallyas e and specifically as e1, e2, e3, e4, e5, e6, e7, e8, e9) are theoperation points p of the function lc(d) due to manufacturing variationsin the switching current magnitude lc(d).

More specifically, the error bars e each specify that the signal levelof the threshold realization current 40 has a probability of switching arandomly fabricated MTJ element (like the MTJ element 20 with the designparameters in the table above) from the high resistance state to the lowresistance state is less than ε when the signal level is below amagnitude of lcmin(d) and a probability of 1-ε when the signal level ofthe threshold realization current 40 is above the magnitude lcmax(d)indicated by the error bar e. For example, for the error bar e1 atoperating point p1 with a pulse duration of 1.6 nanoseconds, themagnitude of lcmin(d) is 165 μA and the magnitude of lcmax(d) is 220 μA.An expected magnitude is 220 μA.

To determine a width w of the transistors 38, simulations were performedwith the data for the function lc(d) to ensure that the majorityfunction of k=4 and N=8 is implemented by the majority function element36. All simulation were performed with a V_(DD)=1V. An onset, M, isequal to the majority value k=4, which is a minimum number of thetransistors 38 that are activated with the pulse duration d=1.6 ns suchthe MTJ element 20 is switched from the high resistance state (and theanti-parallel magnetic orientation alignment state) to the lowresistance state (and the parallel magnetic orientation alignmentstate). An offset, m, is equal to the majority value k minus 1, (i.e.,m=k−1), which is the maximum number of the transistors 38 that can beactivated without the MTJ element 20 being switched from the from thehigh resistance state (and the anti-parallel magnetic orientationalignment state) to the low resistance state (and the parallel magneticorientation alignment state). From the simulations, the width w of thetransistors 38 is selected so that the current level of the thresholdrealization current 40 is generated above the lcmax(d), which in thisexample is 220 μA at the pulse duration d=1.6 ns, when the number oftransistors 38 that are activated is equal to onset, M. Furthermore,from the simulations, the width w of the transistors 38 is selected sothat the current level of the threshold realization current 40 isgenerated below the lcmin(d), which in this example is 165 μA at thepulse duration d=1.6 ns, when the number of transistors 38 that areactivated is equal to offset, m. In this manner, the majority functionelement 36 is fabricated to ensure that the threshold realizationcurrent 40 is generated with the signal level above the switchingcurrent magnitude lc of the of the MTJ element 20 when a number equal tothe onset M (i.e., M=k) of the transistors 38 is activated and with thecurrent level below the switch current magnitude lc of the MTJ element20 when a number equal to the offset, m, (i.e., m=k−1) of thetransistors 38 are activated.

FIG. 5 illustrates another embodiment of a threshold gate 44. Thethreshold gate 44 includes the majority function element 36 describedabove with respect to FIG. 3 and the MTJ element 20 described above withrespect to FIG. 3. The majority function element 36 is thus configuredto generate the threshold realization current 40 as described above withrespect to FIG. 3. In this embodiment, the majority function element 36is configured to receive a write signal, WR, at a terminal 46. Theterminal 46 is connected to a drain of each of the transistors 38. Thus,a write pulse is provided in the write signal WR when the write signalWR is active. During the write pulse, the majority function element 36is transparent to the bit signals 42 and the write pulse is provided forthe pulse duration, d, which in this example is equal to 1.6 ns. In thisembodiment, the write signal WR is at V_(DD) when active and during thewrite pulse.

Accordingly, the threshold gate 44 is transparent while the write signalWR is active during the write pulse (write phase). When the thresholdgate 44 is transparent and the write signal WR is active (write pulse,write phase) and/or asserted, the current level of the thresholdrealization current 40 is provided by the majority function element 36in accordance with the majority function on the bit signals 42, asdescribed above with respect to FIG. 3. More specifically, if thecurrent level of the threshold realization current 40 is less than theswitching current magnitude lc, the MTJ element 20 is maintained in thehigh resistive state (and the anti-parallel magnetic orientationalignment state). If the current level of the threshold realizationcurrent 40 is greater than the switching current magnitude lc, the MTJelement 20 is switched from the high resistive state (and theanti-parallel magnetic orientation alignment state) switches to the lowresistance state (and the parallel magnetic orientation state),otherwise it remains in high resistance state. Once the write signal WRis inactive (unasserted) after the write pulse, the threshold gate 44becomes opaque. In this embodiment, the write signal WR is inactive atground. Since the MTJ element 20 is non-volatile, the MTJ element 20 isheld at the high resistive state (and the anti-parallel magneticorientation alignment state) or the low resistive state (and theparallel magnetic orientation alignment state) as provided while thewrite signal WR was active and during the write pulse (write phase).

The threshold gate 44 further includes a transistor NM1, a transistorNM2, transistor NM3 and another MTJ element 50. The threshold gate 44shown in FIG. 5 is a differential threshold logic gate. Thus, in thisembodiment, the threshold gate 44 has a differential state generationelement 52. The differential state generation element 52 is configuredto generate a differential state signal (DSS) that indicates whether theMTJ element 20 is in the high resistance state (and anti-parallelmagnetic orientation alignment state) or whether the MTJ element 20 isin the low resistance state (and parallel magnetic orientation alignmentstate).

As shown in FIG. 5, the differential state generation element 52includes the transistor NM2, the transistor NM3, and the MTJ element 50.The MTJ element 50 is also an STT-MTJ. The MTJ element 50 has a freemagnetic layer 54 and a fixed magnetic layer 56 and a dielectric layer58 that defines a tunnel barrier of the MTJ element 50. When a magneticorientation of the free magnetic layer 54 and a magnetic orientation ofthe fixed magnetic layer 56 are unaligned, the MTJ element 50 is in ahigh resistive state and in an anti-parallel magnetic orientationalignment state. When a magnetic orientation of the free magnetic layer54 and a magnetic orientation of the fixed magnetic layer 56 arealigned, the MTJ element 50 is in a low resistive state and in ananti-parallel magnetic orientation alignment state. However, the MTJelement 50 is configured to have a constant resistance given by((R_(high)+R_(low))/2) where R_(high) denotes the high resistance valueof the MTJ element 20 and R_(low) denotes the low resistance value ofthe MTJ element 20. It is possible to achieve such a resistance for theMTJ element 50 by changing its physical properties. However, inpractice, this can be achieved by a particular network of four MTJelements with preconfigured magnetic alignment states. Two MTJ elementshaving a resistance of R_(high) are connected in parallel. Additionally,two or more MTJ elements having a resistance of R_(low) are connected inparallel. This series-parallel arrangements of MTJ elements results inthe same resistance of ((R_(high)+R_(low))/2) as the MTJ element 50shown in FIG. 5.

The transistors NM2 and the transistor NM3 are configured to generatethe differential state signal DSS while the read signal RD is activeand/or asserted during a read pulse (read phase). In this embodiment,the transistor NM2 and the transistor NM3 are each N-channel FETs and inparticular NMOSs. The gate of the transistor NM2 and the gate of thetransistor NM3 both receive a read signal RD. A source of transistor NM2is connected to the MTJ element 50 while a source of the transistor NM3is coupled to the MTJ element 20. More specifically, the source of thetransistor NM3 is connected between the majority function element 36 andthe MTJ element 20. A drain of the transistor NM2 is coupled to a nodeN5, and a drain of the transistor NM3 is coupled to a node N6. Thedifferential state signal DSS is output from both of the nodes N5, N6.

The differential state generation element 52 is configured to generatethe differential state signal DSS such that the differential statesignal DSS indicates whether the MTJ element 20 is in the highresistance state (and the anti-parallel magnetic orientation alignmentstate) or in the low resistance state (and the parallel magneticorientation alignment state). This is done by asserting the read signalRD, which generates a read pulse (read phase) in the read signal RD andactivates the read signal RD. The differential state generation element52 is thus transparent to the state of the MTJ element 20 when the readsignal RD is active and/or asserted during the read pulse (read phase).When read signal RD is active (read pulse, read phase), the transistorNM3 and the transistor NM2 are both enabled. Before the read signal RDis asserted, the voltages at the nodes N5 and N6, i.e., signals REF andST, are both at the same voltage (whose value is somewhere betweenV_(DD) and 0). Irrespective of whether the MTJ element 20 is in the highresistive state (R_(high)) or the low resistive state (R_(low)), itsresistance is never equal to that of the MTJ element 50 (which is(R_(high)+R_(low))/2). Therefore, when the read signal RD is asserted(during the read pulse (read phase)), the transistors NM2 and NM3 areenabled and the nodes N5 and N6 discharge through different resistances.This creates a voltage difference between the nodes N5 and N6 which maybe amplified by an external sense amplifier circuit (not shown in FIG.5).

For example, since the TMR of the MTJ element 50 has a TMR value ofabout ½ the TMR value for the TMR of the MTJ element 20, the transistorNM2 generates a reference signal REF having a reference voltage level.In this embodiment, the reference voltage level of the reference signalREF is at V_(DD)/2. As such, during the read pulse (read phase) andwhile the read signal RD is active and/or asserted, the referencevoltage level (i.e., V_(DD)/2) is provided at the node N5. The referencesignal REF is one part of the differential state signal DSS. Also,during the read pulse (read phase) and while the read signal RD isactive and/or asserted, the transistor NM6 generates a state signal SThaving a state voltage level. The state signal ST is another part of thedifferential state signal DSS.

If the MTJ element 20 is in the high resistance state (and theanti-parallel magnetic orientation alignment state), the voltagedifference between the nodes N5 and N6 is negative, i.e., the voltage atthe node N5 is lower than that of the node N6. The external senseamplifier circuit amplifies this difference and produces logical 0 asthe output of threshold function. For example, a state voltage level ofthe state signal ST is approximately equal to V_(DD). A voltagedifference between the reference voltage level of the reference signalVREF and the state voltage level of the state signal ST is thusapproximately −V_(DD)/2. In other words, a voltage difference betweenthe node N5 and the node N6 is thus approximately −V_(DD)/2. On theother hand, if the MTJ element 20 is in the low resistance state (andthe parallel magnetic orientation alignment state), the nodes N5 and N6voltage difference is positive and the external sense amplifieramplifies this difference to produce logical 1 as the output of thethreshold function. For example, a state voltage level of the statesignal ST is approximately equal to a reference voltage level (i.e., inthis example, ground). A voltage difference between the referencevoltage level of the reference signal VREF and the state voltage levelof the state signal ST is thus approximately +V_(DD)/2. In other words,a voltage difference between the node N5 and the node N6 is thusapproximately +V_(DD)/2. When the read signal RD is inactive and/orunasserted after the read pulse (read phase), the differential stategeneration element 52 is opaque to the state of the MTJ element 20.

Next, the threshold gate 44 is also configured to receive a presetsignal PR. At a beginning of a clock cycle [after the write pulse (writephase) when the write signal WR is inactive and the read pulse (readphase) of a previous clock cycle], the preset PR may become activeand/or be asserted during a preset pulse (preset phase). The transistorNM1 operates as a reset device. In this embodiment, the transistor NM1is an N-channel FET and more particularly an NMOS. A drain of thetransistor NM1 is coupled between the majority function element 36,source of the transistor NM1 is coupled to ground, and a gate of thetransistor NM1 is coupled to receive the preset signal PR. Morespecifically, the MTJ element 20 is coupled between the drain of thetransistor NM1 and the gate of the transistor NM1. When the presetsignal PR is active and/or asserted during the preset pulse (presetphase), the transistor NM1 generates a reset current RC across the MTJelement 20. The transistor NM1 is configured to generate the resetcurrent RC such that a current level of the reset current RC is greaterthan the switching current magnitude, but in the opposite direction asthe threshold realization current 40. In other words, the reset currentRC has a current level greater than the switching current magnitude buta current direction opposite the current direction of the thresholdrealization current 40. Thus, the transistor NM1 is configured to ensurethat the MTJ element 20 is in the high resistance state (and theanti-parallel magnetic orientation alignment state) by generating thereset current RC. For example, if the MTJ element 20 were being held inthe high resistance state, the MTJ element 20 would be maintained in thehigh resistance state in response to the reset current RC. On the otherhand, if the MTJ element 20 were being held in the low resistance state,the MTJ element 20 would switch from the low resistance state to thehigh resistance state in response to the reset current RC.

The write signal WR, the read signal RD, and the preset signal PR arecomplementary to one another and thus are not asserted at the same time.In other words, the write pulse (write phase), the read pulse (readphase), and preset pulse (preset phase) occur during different timeintervals of a clock cycle. The write pulse (write phase), the readpulse (read phase), and preset pulse (preset phase) may be repeatedevery clock cycle as determined by a clock signal.

FIG. 6 illustrates a sequential state threshold logic element 60. Thesequential state threshold logic element 60 includes the threshold gate44 described above with respect to FIG. 5. In addition, the sequentialstate threshold logic element 60 includes a sense amplifier element SAand a latch L. The sense amplifier element SA is coupled to the nodesN5, N6 of the threshold gate 44. Accordingly, the sense amplifierelement SA is configured to receive the differential state signal DSSfrom the threshold gate 44. The sense amplifier element SA is alsoconfigured to receive the read signal RD.

During the read pulse (read phase) and while the read signal RD isactive and/or asserted, the sense amplifier element SA is configured togenerate a first logic state signal 62 and a second logic state signal64 in accordance with the voltage difference of the differential statesignal DSS. The first logic state signal 62 and the second logic statesignal 64 are logically inverted with respect to one another during theread pulse (read phase) and while the read signal RD is active and/orasserted. Accordingly, when the voltage difference of the differentialstate signal DSS between the node N5 and the node N6 is negative (forexample, −V_(DD)/2), the sense amplifier element SA generates the firstlogic state signal 62 with a high voltage state (logical 1) (which inthis example is around V_(DD)) and the second logic state signal 64 witha low voltage state (logical 0), (which in this example is aroundground). Thus, as a result of the MTJ element 20 being in the highresistance state (and the anti-parallel magnetic orientation alignment),the first logic state signal 62 has the high voltage state (logical 1)and the second logic state signal 64 has the low voltage state (logical0). On the other hand, when the voltage difference of the differentialstate signal DSS between the node N5 and the node N6 is positive (forexample, +V_(DD)/2), the sense amplifier element SA generates the firstlogic state signal 62 with a low voltage state (logical 0) (which inthis example is around ground) and the second logic state signal 64 witha high voltage state (logical 1), (which in this example is aroundV_(DD)). Thus, as a result of the MTJ element 20 being in the lowresistance state (and the parallel magnetic orientation alignment), thefirst logic state signal 62 has the low voltage state (logical 1) andthe second logic state signal 64 has the low voltage state (logical 0).

The latch L also is configured to receive the read signal RD. In thisembodiment, the latch L is transparent during the read pulse (readphase) and while the read signal RD is active and/or asserted. In thisembodiment, the latch L thus generates a bit output signal Q and aninverted bit output signal Q. The bit output signal Q represents a bitand an inverted bit output signal Q represents an inversion of the samebit. More specifically, while the latch L is transparent, the bit outputsignal Q is generated by the latch L in a high voltage state (logical 1)or a low voltage state (logical 0), depending on the voltage state ofthe first logic state signal 62 and the voltage state of the secondlogic state signal 64. The inverted bit data signal Q is generated inthe inverted voltage state of the bit output signal Q.

Outside the read pulse (read phase) and while the read signal RD isinactive and/or unasserted, the latch L is configured to be opaque tothe first logic state signal 62 and the second logic state signal 64 andto hold the voltage state of the bit output signal Q and the voltagestate of the inverted bit output signal Q.

FIG. 7 illustrates a threshold logic array of threshold gates 44(A)(1),44(A)(2), 44(B)(1), 44(B)(2). Each of the threshold gates 44(A)(1),44(A)(2), 44(B)(1), 44(B)(2) has the same topology as the threshold gate44 illustrated in FIG. 5. Thus, each of the threshold gates 44(A)(1),44(A)(2), 44(B)(1), 44(B)(2) generates a corresponding differentialstate signal DSS(A)(1), DSS(A)(2), DSS(B)(1), DSS(B)(2), respectively.In this embodiment, the threshold logic array 66 is a threshold logicblock wherein the threshold logic block is a 2×2 threshold logic array.Each of the threshold gates 44(A)(1), 44(A)(2), 44(B)(1), 44(B)(2) hasthe same configuration as the threshold gate 44 described above withrespect to FIG. 5.

Letters (i.e., A and B) indicate a row of the threshold logic array 66.More specifically, within the threshold logic block, the Letter Aindicates an upper row pair of threshold gates 44(A)(1) and 44(A)(2).Letter B indicates an low row pair of the threshold gates 44(B)(1) and44(B)(2). Generically, the threshold gates 44(A)(1) and 44(A)(2) in theupper row pair and the threshold gates 44(B)(1) and 44(B)(2) in thelower row pair may be referred to as a row pair of the threshold gates44(1) and 44(2). Also, generically, the differential state signalDSS(A)(1) and differential state signal DSS(A)(2) for the upper row pairand the differential state signal DSS(B)(1) and differential statesignal DSS(B)(2) for the lower row pair may be referred to as thedifferential state signal DSS(1) and differential state signal DSS(2).

Numbers (i.e., 1 and 2) indicate a column of the threshold logic array66. More specifically, within the threshold logic block, the number 1indicates a left column pair the threshold gates 44(A)(1) and 44(B)(1).Number 2 indicates an right column pair of the threshold gates 44(A)(2)and 44(B)(2). Generically, the threshold gates 44(A)(1) and 44(B)(1) inthe left column pair and the threshold gates 44(A)(2) and 44(B)(2) inthe right column pair may be referred to as a column pair of thethreshold gates 44(A) and 44(B). Also, generically, the differentialstate signal DSS(A)(1) and differential state signal DSS(B)(1) for theleft row pair and the differential state signal DSS(A)(2) anddifferential state signal DSS(B)(2) for the right column pair may bereferred to as the differential state signal DSS(A) and differentialstate signal DSS(B).

In this embodiment, a sequential state threshold logic element 68Aincludes the upper row pair of threshold gates 44(A)(1) and 44(A)(2).The sequential state threshold logic element 68A has a sense amplifierelement SA(A) and an SR latch L(A). The sense amplifier element SA(A)receives both the differential state signal DSS(A)(1) from the thresholdgate 44(A)(1) and the DSS(A)(2) the differential state signal DSS(A)(2).The sense amplifier element SA(A) is configured to generate a firstlogic state signal 62(A) as a set signal for the SR latch L(A) and asecond logic state signal 64A as a reset signal for the SR latch L(A).

A sequential state threshold logic element 68B includes the low row pairof threshold gates 44(B)(1) and 44(B)(2). The sequential state thresholdlogic element 68B has a sense amplifier element SA(B) and an SR latchL(B). The sense amplifier element SA(B) receives both the differentialstate signal DSS(B)(1) from the threshold gate 44(B)(1) and theDSS(B)(2) the differential state signal DSS(B)(2). The sense amplifierelement SA(B) is configured to generate a first logic state signal 62(B)as a set signal for the SR latch L(B) and a second logic state signal64(B) as a reset signal for the SR latch L(B). Generically, thesequential state threshold logic elements 68A, 68B are referred to assequential state threshold logic element 68 since both have the sametopology.

A control circuit is configured to generate the preset signal PR, awrite signal WR_1, a receive signal RD_1, a write signal WR_2, and aread signal RD_2. All of the threshold gates 44(A)(1), 44(A)(2),44(B)(1), 44(B)(2) receive the preset signal PR. The left column pair ofthreshold gates 44(A)(1) and 44(B)(1) each receive the write signal WR_1and the read signal RD_1. The right column pair of threshold gates44(A)(1) and 44(B)(1) each receive the write signal WR_2 and the readsignal RD_2. Thus, for each of the sequential state threshold logicelements 68, the threshold gate 44(1) receives the write signal WR_1 andthe read signal RD_1. The threshold gate 44(2) receives the write signalWR_2 and the read signal RD_2. In each of the sequential state thresholdlogic elements 68 (i.e., both 68A, 68B), the sense amplifier element SA(i.e., both SA(A) and SA(B)) receive the OR of both of the read signalsRD_1 and RD_2 (collectively called an RD signal). This OR gate (notshown explicitly) ensures that sense amplifiers SA(A) and SA(B) areactive when either the read signal RD_1 is active (column 1 is active)or the read signal RD_2 is active (column 2 is active).

Feedforward device 70A and feedforward device 70B may includemultiplexers and/or decoding circuits configured to route theappropriate bit signals through the bit lines a-z to the threshold gates44(A)(1), 44(A)(2), 44(B)(1), 44(B)(2). The setup and hold timing forthe bit signals on bit lines may be timed by a clock signal Clk, so thatthe feedforward device 70A and feedforward device 70 transfer the bitoutput signal Q and the inverted bit output signal Q from the SR LatchesL(A), L(B) through the bit lines a-z so as to operate the thresholdgates 44(A)(1), 44(A)(2), 44(B)(1), 44(B)(2) in accordance with apipeline design.

FIG. 8 illustrates one embodiment of a timing diagram with a clocksignal Clk, the preset signal PR, the write signal WR_1, the read signalRD_1, the write signal WR_2, and the read signal RD_2. The clock signalClk, the preset signal PR, the write signal WR_1, the read signal RD_1,the write signal WR_2, and the read signal RD_2 are used to time theoperation of the threshold logic array 66 shown in FIG. 7. Each of thesesignals are complementary and thus occur during different temporalportions of the clock cycle. The clock signal Clk may be an externallyprovided clock signal that is provided to the control circuit in orderto time the operation of the threshold logic array 66 (shown in FIG. 7)and the feedforward devices 70A, 70B. In FIG. 8, the clock signal Clk,is illustrated during a single clock cycle 72. Thus, the preset signalPR, the write signal WR_1, the read signal RD_1, the write signal WR_2,and the read signal RD_2 are also each shown during a single clockcycle. As clock cycles of the clock signal Clk repeat, so do the waveforms of the write signal WR_1, the read signal RD_1, the write signalWR_2, and the read signal RD_2. As shown in FIG. 8, the preset signal PRis active (asserted) and provided with a preset pulse PP, the writesignal WR_1 is active (asserted) and provided with a write pulse WP1,and the read signal RD_1 is active (asserted) and provided with a readpulse RP1. The write signal WR_2 is active (asserted) and provided witha write pulse WP2, and the read signal RD_2 is active (asserted) andprovided with a read pulse RP2. All of the signals, i.e., PR, WR_1,RD_1, WR_2, RD_2, must occur between consecutive rising edges of clocksignal Clk.

Referring now to FIGS. 7 and 8, initially all the threshold gates44(A)(1), 44(A)(2), 44(B)(1), 44(B)(2) are preset by asserting (i.e.,providing the preset pulse PP) the preset signal PR. In this embodiment,the operation of the threshold logic array 66 is done column wise. Morespecifically, the left column pair of threshold gates 44(A)(1) and44(B)(1) in each of the sequential state threshold logic elements 68Aand 68B receives a write-read signal pair (WR_1, RD_1). When the writesignal WR_1 is asserted (i.e., the write pulse WP1 is provided), theleft column pair of threshold gates 44(A)(1) and 44(B)(1) in each of thesequential state threshold logic elements 68A and 68B implements theirrespective threshold functions in accordance with bit signals from thebit lines a-z routed to the threshold gates 44(A)(1) and 44(B)(1).

The read signal RD_1 is then asserted (i.e., read pulse RP1 is provided)and the threshold gate 44(A)(1) generates the differential state signalDSS(A)(1) and the threshold gate 44(B)(1) generates the differentialstate signal DSS(B)(1). The sense amplifier element SA(A) generates thefirst logic state signal 62(A) and the second logic state signal 64(A)in accordance with the differential state signal DSS(A)(1). As a result,the SR latch L(A) then generates the bit output signal Q(A) and theinverted bit output signal Q(A) in accordance with the first logic statesignal 62(A) and the second logic state signal 64(A). Additionally, thesense amplifier element SA(B) generates the first logic state signal62(B) and the second logic state signal 64(B) in accordance with thedifferential state signal DSS(B)(1). As a result, the SR latch L(B) thengenerates the bit output signal Q(B) and the inverted bit output signalQ(B) in accordance with the first logic state signal 62(B) and thesecond logic state signal 64(B). After the read signal RD_1 isunasserted (i.e., after the read pulse RP1), the SR latch L(A) holds thebit output signal Q(A) and the inverted bit output signal Q(A) and theSR latch L(B) holds the bit output signal Q(B) and the inverted bitoutput signal Q(B).

The bit output signal Q(A) and the inverted bit output signal Q(A) beingheld by the SR latch L(A) and the bit output signal Q(B) and theinverted bit output signal Q(B) from the SR latch L(B) are then providedto the right column pair of the threshold gates 44(A)(2) and 44(B)(2)depending on the overall function mapped on to the overall thresholdgate array. Repeaters can be provided to avoid fan out issues. In thisembodiment, the right column pair of threshold gates 44(A)(2) and44(B)(2) in each of the sequential state threshold logic elements 68Aand 68B receive a write-read signal pair (WR_2, RD_2). When the writesignal WR_2 is asserted (i.e., the write pulse WP2 is provided), theright column pair of threshold gates 44(A)(2) and 44(B)(2) in each ofthe sequential state threshold logic elements 68A and 68B implementtheir respective threshold functions in accordance with bit signals fromthe bit lines a-z routed to the threshold gates 44(A)(2) and 44(B)(2).The bit lines a-z may include the bit output signal Q(A) and theinverted bit output signal Q(A) being held by the SR latch L(A) and thebit output signal Q(B) and the inverted bit output signal Q(B) beingheld by the SR latch L(B).

The read signal RD_2 is then asserted (i.e., read pulse RP2 is provided)and the threshold gate 44(A)(2) generates the differential state signalDSS(A)(2) and the threshold gate 44(B)(2) generates the differentialstate signal DSS(B)(2). The sense amplifier element SA(A) generates thefirst logic state signal 62(A) and the second logic state signal 64(A)in accordance with the differential state signal DSS(A)(2). As a result,the SR latch L(A) then generates the bit output signal Q(A) and theinverted bit output signal Q(A) in accordance with the first logic statesignal 62(A) and the second logic state signal 64(A). Additionally, thesense amplifier element SA(B) generates the first logic state signal62(B) and the second logic state signal 64(B) in accordance with thedifferential state signal DSS(B)(2). As a result, the SR latch L(B) thengenerates the bit output signal Q(B) and the inverted bit output signalQ(B) in accordance with the first logic state signal 62(B) and thesecond logic state signal 64(B). After the read signal RD_2 isunasserted (i.e., after the read pulse RP2), the SR latch L(A) holds thebit output signal Q(A) and the inverted bit output signal Q(A), and theSR latch L(B) holds the bit output signal Q(B) and the inverted bitoutput signal Q(B). The next clock cycle may then begin and the bitlines a-z may include the bit output signal Q(A) and the inverted bitoutput signal Q(A) being held by the SR latch L(A) and the bit outputsignal Q(B) and the inverted bit output signal Q(B) being held by the SRlatch L(B).

FIG. 9 illustrates one embodiment of a sequential state threshold logicelement 68, where each of the sequential state threshold logic elements68A, 68B in FIG. 7 may be provided in accordance with the topology ofthe sequential state threshold logic element 68. In this embodiment, theSR Latch is not illustrated for the sake of clarity. The sequentialstate threshold logic element includes the row pair of threshold gates44(1) and 44(2) (the upper row pair of threshold gates 44(A)(1) and44(A)(2) in FIG. 7 and the low row pair of the threshold gates 44(B)(1)and 44(B)(2) in FIG. 7) of the sequential state threshold logic element68. Each of the threshold gates 44(1) and 44(2) is arranged inaccordance with the threshold gate 44 illustrated in FIG. 5.Accordingly, the threshold gate 44(1) includes an MTJ element 20(1)(like the MTJ element 20 in FIG. 5), a majority function element 36(1)(like the majority function element 36 in FIG. 3), an MTJ element 50(1)(like the MTJ element 50 in FIG. 5), a transistor NM1 ₁ (like thetransistor NM1 in FIG. 5), a transistor NM2 ₁ (like the transistor NM2in FIG. 5), and a transistor NM3 ₁ (like the transistor NM3 shown inFIG. 5). The threshold gate 44(2) includes an MTJ element 20(2) (likethe MTJ element 20 in FIG. 3). The threshold gate 44(2) includes an MTJelement 20(2) (like the MTJ element 20 in FIG. 5), a majority functionelement 36(2) (like the majority function element 36 in FIG. 3), an MTJelement 50(2) (like the MTJ element 50 in FIG. 5), a transistor NM1 ₂(like the transistor NM1 in FIG. 5), a transistor NM2 ₂ (like thetransistor NM2 in FIG. 5), and a transistor NM3 ₂ (like the transistorNM3 shown in FIG. 5).

Each of the threshold gates 44(1) and 44(2) in the row pair receive thepreset signal PR. The majority function element 36(1) receives the writesignal, WR_1 and the transistor NM2 ₁ and the transistor NM3 ₁ receivethe read signal RD_1. The majority function element 36(1) thusimplements its corresponding majority function and thus determines thestate of the MTJ element 20(1) when the write signal WR_1 is asserted.The transistor NM2 ₁ and the transistor NM3 ₁ generate the differentialstate signal DSS(1) (the differential state signal DSSA(1) forsequential state threshold logic element 68A in FIG. 7 and thedifferential state signal DSSB(1) for sequential state threshold logicelement 68B) based on the state of the MTJ element 20(1) when the readsignal RD_1 is asserted. The majority function element 36(2) receivesthe write signal, WR_2 and the transistor NM2 ₂ and the transistor NM3 ₂receive the read signal RD_2. The majority function element 36(2)implements its corresponding majority function and thus determines thestate of the MTJ element 20(2) when the write signal WR_2 is asserted.The transistor NM2 ₂ and the transistor NM3 ₂ generate the differentialstate signal DSS(2) (the differential state signal DSSA(2) forsequential state threshold logic element 68A in FIG. 7 and thedifferential state signal DSSB(2) for sequential state threshold logicelement 68B) based on the state of the MTJ element 20(2) when the readsignal RD_1 is asserted. The sense amplifier element SA shown in FIG. 9is configured to evaluate the state of the MTJ element 20(1) from thedifferential state signal DSS(1) and evaluate the state of the MTJelement 20(2) from the differential state signal DSS(2). In thisembodiment, sense amplifier element SA has two PMOSs (PMOS PM1 and PMOSPM2) and inverters (PMOS PM3, NMOS NM5 and PMOS PM4, NMOS NM6) that arecross coupled between nodes N1 and N2, respectively. The NMOS NM5 andthe NMOS NM6 receive the differential state signal DSS(1) from thethreshold gate 44(1) and the differential state signal DSS(2) from thethreshold gate 44(2). The nodes N1 and N2 are connected to the SR Latch(not shown).

Alternatively or additionally, the gates of the PMOSs PM1 and PM2receive an output from an OR gate, wherein the read signals RD_1, RD_2are inputs to the OR gate (i.e., output is equal to RD_1 v RD_2).Alternatively, threshold gates may be implemented where the firstresistive state is a low resistive state and second resistive state is ahigh resistive state. During the write pulse, enough active transistorsswitch the MTJ element from a low resistive state to a higher resistivestate, and not otherwise. The preset signal PR now ensures that the MTJelement starts in a low resistive state before application of the writepulse. The simplest change to accommodate the reversed meaning of finalresistive states of MTJ element is to interchange the nodes N1 and N2(i.e., interchange their connections to the S and R inputs of the SRlatch) in the sense amplifier element SA shown in FIG. 9. Thesethreshold gates are functionally identical to the threshold gates shownin FIG. 9.

A gate of the PMOS PM1 receives the read signals, RD_1, RD_2, i.e., RD_1v RD_2. Additionally, a gate of the PMOS PM2 also receives the readsignals RD_1, RD_2. The gates of the PMOS PM1 and PMOS PM2 are both in alow voltage state (ground) when both of the read signals, RD_1, RD_2 areunasserted. Thus, when both of the read signals RD_1, RD_2 areunasserted, the PMOS PM1 and the PMOS PM2 are activated and the nodes N1and N2 are pre-charged to a high voltage state (˜V_(DD)). This is calleda reset phase. During the reset phase, the nodes N5 and N6 are both atV_(DD)-Vth. In contrast, the gates of the PMOS PM1 and the PMOS PM2 areboth at the high voltage state when any of the read signals RD_1, RD_2is asserted. Accordingly, the PMOS PM1 and the PMOS PM2 are bothdeactivated (turned OFF) when any one of the read signals RD_1, RD_2 isasserted, i.e., in an evaluation phase.

Accordingly, there are two evaluation phases during each clock cycle.When the read signal RD_1 is asserted and the read signal RD_2 isunasserted (first evaluation phase), the sense amplifier element SAevaluates the state of the MTJ element 20(1) based on the DSS(1). If theMTJ element 20(1) is in the high resistance state (and the anti-parallelmagnetic orientation alignment), the DSS(1) has a negative voltage leveldifference from the node N5 to the node N6. Accordingly, more current isdrawn from the node N2 than the node N1. Thus, the node N2 dischargesfaster than the node N1. As a result, the PMOS PM4 is activated, pullingthe node N1 to a high voltage state (˜V_(DD) and a logical 1) and thenode N2 to a low voltage state (˜ground and a logical 0). In contrast,if the MTJ element 20(1) is in the low resistance state (and theparallel magnetic orientation alignment), the DSS(1) has a positivevoltage level difference from the node N5 to the node N6. As a result,more current is drawn from the node N1 than the node N2. Thus, the nodeN1 discharges faster than the node N2. As a result, the PMOS PM3 isactivated, pulling the node N2 to a high voltage state (˜V_(DD) and alogical 1) and the node N1 to a low voltage state (˜ground and a logical0).

When the read signal RD_2 is asserted and the read signal RD_1 isunasserted (second evaluation phase), the sense amplifier element SAevaluates the state of the MTJ element 20(2) based on the DSS(2). If theMTJ element 20(2) is in the high resistance state (and the anti-parallelmagnetic orientation alignment), the DSS(2) has a negative voltage leveldifference from the node N5 to the node N6. Accordingly, more current isdrawn from the node N2 than the node N1. Thus, the node N2 dischargesfaster than the node N1. As a result, the PMOS PM4 is activated, pullingthe node N1 to a high voltage state (˜V_(DD) and a logical 1) and thenode N2 to a low voltage state (˜ground and a logical 0). In contrast,if the MTJ element 20(2) is in the low resistance state (and theparallel magnetic orientation alignment), the DSS(2) has a positivevoltage level difference from the node N5 to the node N6. As a result,more current is drawn from the node N1 than the node N2. Thus, the nodeN1 discharges faster than the node N2. As a result, the PMOS PM3 isactivated, pulling the node N2 to a high voltage state (˜V_(DD) and alogical 1) and the node N1 to a low voltage state (˜ground and a logical0). The nodes N1 and N2 provide the first logic state signal 62 (thefirst logic state signal 62A for the sequential state threshold logicelement 68A in FIG. 7 and the first logic state signal 62B for thesequential state threshold logic element 68B) and the second logic statesignal 64 (the second logic state signal 64A for the sequential statethreshold logic element 68A in FIG. 7 and the second logic state signal64B for the sequential state threshold logic element 68B).

FIG. 10 illustrates the threshold logic block in FIG. 7 programmed so asa two bit carry look-ahead (CLA) adder. The threshold gate 44(A)(1) hasbeen programmed to compute a carry, with Boolean variables A0, B0 andCin. As such, a majority function element (like the majority functionelement 36 shown in FIG. 3 and the majority function element 36(1) shownin FIG. 9) of the threshold gate 44(A)(1) has been programmed toimplement a threshold function [1, 1, 1; 2]. The threshold function [1,1, 1; 2] corresponds with a Boolean function, carry=ab+bc+ca, whichcomputes a binary value of the Boolean variable C0. The threshold gate44(A)(2) has been programmed to compute a sum, with Boolean variablesC0, Cin, A0, B0. As such, a majority function element (like the majorityfunction element 36 shown in FIG. 3 and the majority function element36(2) shown in FIG. 9) of the threshold gate 44(A)(2) has beenprogrammed to implement a threshold function implement a thresholdfunction [−2, 1, 1, 1; 1]. The threshold function [−2, 1, 1, 1; 1]corresponds with a Boolean function, abc+(a+b+c) carry, which computes abinary value of a Boolean variable S0. Accordingly, the threshold gates44(A)(1) and 44(A)(2) of the sequential state threshold logic element68A have been programmed to operate as a first stage adder for the twobit adder.

The threshold gate 44(B)(1) has been programmed to compute a carry, withBoolean variables B1, A1, A0, B0, Cin. As such, a majority functionelement (like the majority function element 36 shown in FIG. 3 and themajority function element 36(1) shown in FIG. 9) of the threshold gate44(B)(1) has been programmed to implement a threshold function [2, 2, 1,1, 1; 4]. The threshold function [2, 2, 1, 1, 1; 4] corresponds with aBoolean function, carry=2a+b+c+d+e, which computes a binary value of aBoolean variable C1. The threshold gate 44(B)(2) has been programmed tocompute a sum, with Boolean variables C1, C0, A1, B1. As such, amajority function element (like the majority function element 36 shownin FIG. 3 and the majority function element 36(2) shown in FIG. 9) ofthe threshold gate 44(A)(2) has been programmed to implement a thresholdfunction [−2, 1, 1, 1; 1]. The threshold function [−2, 1, 1, 1; 1]corresponds with a Boolean function, abc+(a+b+c) carry, which computesthe binary value of a Boolean variable S1. Negative weights may beimplemented through using inverters. Note that no extra inverters areneeded since latch produces complemented outputs. Accordingly, thethreshold gates 44(B)(1) and 44(B)(2) of the sequential state thresholdlogic element 68B have been programmed to operate as a second stageadder for the two bit adder.

FIG. 11 illustrates one embodiment of a four bit CLA adder implementedusing several of the two bit CLA adders as described above in FIG. 10.This pattern of four bit CLA adders is repeated four times to constructa sixteen bit CLA adder having threshold gates 1-32. Each carry and sumone bit adder has been numbered and the correspondence is as follows.The threshold gates 1, 5, 9, 13, 17, 21, 25, and 29 implement thethreshold function [1, 1, 1; 2] function, in the same manner as thethreshold gate 44(A)(1) described above in FIG. 10. The threshold gates2, 6, 10, 14, 18, 22, 26, and 30, implement the sum as [−2, 1, 1, 1; 1],in the same manner as the threshold gate 44(A)(2) described above inFIG. 10. The threshold gates 3, 7, 11, 15, 19, 23, 27, and 31 implementthe second stage carry as [2, 2, 1, 1, 1; 4], in the same manner as thethreshold gate 44(B)(1) described above in FIG. 10. The threshold gates4, 8, 12, 16, 20, 24, 28, and 32 implement the sum as the thresholdfunction [−2, 1, 1, 1; 1], in the same manner as the threshold gate44(B)(2) described above in FIG. 10. Parallelism in the threshold gateblocks may be used to reduce the number of rows and column.

Those skilled in the art will recognize improvements and modificationsto the preferred embodiments of the present disclosure. All suchimprovements and modifications are considered within the scope of theconcepts disclosed herein and the claims that follow.

What is claimed is:
 1. A threshold gate, comprising: a magnetic tunneljunction (MTJ) element switchable from a first resistive state to asecond resistive state; and a threshold realization element comprising aplurality of transistors configured to switch the MTJ element from thefirst resistive state to the second resistive state in accordance with athreshold function.
 2. The threshold gate of claim 1 wherein the firstresistive state is a high resistive state and the second resistive stateis a low resistive state.
 3. The threshold gate of claim 1 wherein thethreshold realization element is configured to generate a signal havinga signal level and the MTJ element is operable to receive the signalfrom the threshold realization element and wherein: the MTJ element isswitchable from the first resistive state to the second resistive statein response to the signal level of the signal being greater than aswitching magnitude; and the threshold realization element is configuredto provide the signal level of the signal greater than the switchingmagnitude so as to switch the MTJ element from the first resistive stateto the second resistive state.
 4. The threshold gate of claim 3 whereinthe threshold realization element is operable to receive a thresholdinput that indicates a threshold value of the threshold function and isconfigured to adjust the threshold value of the threshold function sothat the threshold value corresponds to the switching magnitude.
 5. Thethreshold gate of claim 4 wherein the threshold realization element isconfigured to: receive a Boolean input that represents a set of Booleanvariables for the threshold function; provide the signal level of thesignal such that the signal level represents a scalar product of the setof Boolean variables and a set of weights of the threshold function. 6.The threshold gate of claim 1 wherein the MTJ element is a spin torquetransfer MTJ element.
 7. The threshold gate of claim 1 wherein the MTJelement comprises: a first magnetic layer; and a second magnetic layer,wherein a tunneling barrier is defined between the first magnetic layerand the second magnetic layer.
 8. The threshold gate of claim 7 furthercomprising a dielectric layer that defines the tunneling barrier betweenthe first magnetic layer and the second magnetic layer.
 9. The thresholdgate of claim 7 wherein: the first magnetic layer is made from a firstferromagnetic material; and the second magnetic layer is made from asecond ferromagnetic material.
 10. The threshold gate of claim 7wherein: the MTJ element is configured to be in the first resistivestate as result of a magnetic orientation state of the first magneticlayer and a magnetic orientation state of the second magnetic layerhaving first alignment with respect to one another; and the MTJ elementis configured to be in the second resistive state as a result of themagnetic orientation state of first magnetic layer and the magneticorientation state of the second magnetic layer having a second alignmentwith respect to one another.
 11. The threshold gate of claim 10 wherein:the first magnetic layer is a free magnetic layer, wherein the magneticorientation state of the free magnetic layer is adjustable; and thesecond magnetic layer is a fixed magnetic layer, wherein the magneticorientation state of the fixed magnetic layer is fixed.
 12. Thethreshold gate of claim 11 wherein the threshold realization element isconfigured to adjust the magnetic orientation state so that the magneticorientation state of the free magnetic layer and the magneticorientation state of the second magnetic layer is switched from thefirst alignment to the second alignment.
 13. The threshold gate of claim1 wherein the threshold realization element comprises a majorityfunction element configured to implement a majority function.
 14. Thethreshold gate of claim 13 wherein the majority function elementcomprises the plurality of transistors so that the majority functionelement is programmable in accordance to a set of weights and athreshold value of the threshold function so that the majority functionelement implements the threshold function.
 15. The threshold gate ofclaim 13 wherein the majority function element is configured to receivebinary bit signals representing bits, wherein the majority functionelement is configured to generate a threshold realization current suchthat a current level monotonically corresponds with an aggregated sum ofthe bits represented by the binary bit signals.
 16. The threshold gateof claim 13 wherein the MTJ element is operable to receive a thresholdrealization current and is switchable from the first resistive state tothe second resistive state in response to a current level of thethreshold realization current being greater than a switching currentmagnitude; and the majority function element comprises the plurality oftransistors and the plurality of transistor are a number, N of fieldeffect transistors (FETs) and is configured to receive bit signalsrepresenting bits, the majority function element is configured toimplement the majority function by generating the threshold realizationcurrent with the current level greater than the switching currentmagnitude when in response to at least a number k of the N number of theFETs being activated as a result of the bit signals.
 17. The thresholdgate of claim 16 wherein the N number of the FETs are coupled inparallel and the majority function element is configured to implementthe majority function by switching the MTJ element from the firstresistive state to the second resistive state in response to at least anumber k of the N number of the FETs being activated.
 18. The thresholdgate of claim 13 wherein the majority function element comprises theplurality of transistors and the plurality of transistor are a number, Nof field effect transistors (FETs) coupled in parallel, wherein themajority function element is configured to implement the majorityfunction by switching the MTJ element from the first resistive state tothe second resistive state in response to at least a number k of the Nnumber of the FETs being activated.
 19. The threshold gate of claim 18wherein: the majority function element is configured to generate athreshold realization current having a current level provided inaccordance with how many of the N number of the FETs are activated andthe MTJ element is operable to receive the threshold realization currentfrom the majority function element; the MTJ element is switchable fromthe first resistive state to the second resistive state in response tothe current level of the threshold realization current being greaterthan a switching current magnitude; and the majority function element isconfigured to provide the current level of the threshold realizationcurrent such that the current level is greater than the switchingcurrent magnitude in response to at least the number k of the N numberof the FETs being activated.
 20. The threshold gate of claim 13 whereinthe MTJ element is operable to receive a threshold realization currentand is switchable from the first resistive state to the second resistivestate in response to a current level of the threshold realizationcurrent being greater than a switching current magnitude; and themajority function element comprises the plurality of transistors and theplurality of transistor are a number, N of field effect transistors(FETs) wherein the majority function element is configured to: receivebit signals representing bits; receive a write signal; and implement themajority function by generating the threshold realization current withthe current level greater than the switching current magnitude inresponse to at least a number k of the N number of the FETs beingactivated as a result of the bit signals and when the write signal isactive.
 21. The threshold gate of claim 14 further comprising a resetdevice wherein: the MTJ element is further configured to receive a resetsignal; the reset device is configured to generate a reset currentacross the MTJ element when the reset signal is active, wherein acurrent level of the reset current is greater in magnitude than anegative of a switching current magnitude.
 22. The threshold gate ofclaim 1 further comprising a differential state generation elementconfigured to generate a differential state signal that indicateswhether the MTJ element is in the first resistance state or the secondresistance state.
 23. The threshold gate of claim 22 wherein thedifferential state generation element is operable to receive a readsignal and is configured to generate the differential state signal inresponse to the read signal being active.
 24. A threshold gate,comprising: a magnetic tunnel junction (MTJ) element switchable from afirst magnetic orientation alignment state to a second magneticorientation alignment state; a threshold realization element comprisinga plurality of transistors configured to switch the magnetic tunneljunction element from the first magnetic orientation alignment state tothe second magnetic orientation alignment state in accordance with athreshold function.
 25. The threshold gate of claim 24 wherein the firstmagnetic orientation alignment state is an anti-parallel magneticorientation alignment state and the second magnetic orientationalignment state is a parallel magnetic orientation alignment state. 26.A threshold gate, comprising: a passive resistive element having a firstnon-volatile resistance state and a second non-volatile resistancestate, wherein the passive resistive element is switchable from a firstresistive state to a second resistive state; and a threshold realizationelement comprising a plurality of transistors configured to switch thepassive resistive element from the first resistive state to the secondresistive state in accordance with a threshold function.
 27. Thethreshold gate of claim 26 wherein the passive resistive element isselected from a group consisting of a magnetic tunnel junction (MTJ)element, a memristor element, and a phase change device.